Advances in thin-film deposition expose new frontiers to structures and phases that are inaccessible by conventional chemical means and have led to innovative modification of existing materials' properties. Thin-film deposition by magnetron sputtering is highly dependent on ion bombardments; coupled with sublimation of solid target unto the substrate through momentum transfer. It is summarily base on phase change of target material under high-energy influence; corresponding controlled condensation of sputtered atoms on substrate material during which process parameters and growth conditions dictate the pace of the atomic scale processes for thin-film formation. Magnetron sputtering is a state-of-the-art thin film deposition technique versatile for several unique applications, especially in the semiconductor industry. Magnetron sputtering is very novel in its use to achieve low-pressure condition that maximizes and conserve stream of electrons for effective knocking of inert atoms into ions. This ensures the highenergy acquired is not dissipated in gas-phase collisions.
Odetola, P. I., Popoola, P., & Oladijo, P. (2018). Thin coating deposition by magnetron sputtering: Production, Properties, and Applications of High Temperature Coatings. In Production, Properties, and Applications of High Temperature Coatings (pp. 403-428). IGI Global. https://doi.org/10.4018/978-1-5225-4194-3.ch015