The influence of intermediate particles on the nucleation of copper on polycrystalline platinum

A. I. Danilov, J. E.T. Andersen, E. B. Molodkina, Yu M. Polukarov, P. Møller, J. Ulstrup

Research output: Contribution to journalArticle

35 Citations (Scopus)

Abstract

The influences of the Cu adatoms and Cu+ ions on the initial stages of copper electrodeposition on polycrystalline Pt in acidified copper sulphate solution have been studied by cyclic voltammetry, potentiostatic current transients, rotating ring-disk electrode (rrde), and in situ scanning tunnelling microscopy (STM). It has been established that during the long-time polarization of the platinum electrode, at potentials close to the copper equilibrium potential, the concentration of Cu+ ions in the vicinity of the electrode increases and a Cu microdeposit if formed. The dissolution of the microdeposit occurs very slowly and takes several minutes of potential cycling in the range of 0.27-1.25 V. While the microdeposit is present on the platinum, the electrode surface is more active with respect to upd and bulk copper deposition. The combination of electrochemical and in situ STM results indicates that formation of surface alloy occurs during electrodeposition of copper on polycrystalline platinum.

Original languageEnglish
Pages (from-to)733-741
Number of pages9
JournalElectrochimica Acta
Volume43
Issue number7
DOIs
Publication statusPublished - Dec 15 1997

Fingerprint

Platinum
Copper
Nucleation
Electrodes
Scanning tunneling microscopy
Electrodeposition
Ions
Copper Sulfate
Adatoms
Cyclic voltammetry
Dissolution
Polarization

All Science Journal Classification (ASJC) codes

  • Chemical Engineering(all)
  • Electrochemistry

Cite this

Danilov, A. I. ; Andersen, J. E.T. ; Molodkina, E. B. ; Polukarov, Yu M. ; Møller, P. ; Ulstrup, J. / The influence of intermediate particles on the nucleation of copper on polycrystalline platinum. In: Electrochimica Acta. 1997 ; Vol. 43, No. 7. pp. 733-741.
@article{fb677697e0184ffcace4eeeff72657b6,
title = "The influence of intermediate particles on the nucleation of copper on polycrystalline platinum",
abstract = "The influences of the Cu adatoms and Cu+ ions on the initial stages of copper electrodeposition on polycrystalline Pt in acidified copper sulphate solution have been studied by cyclic voltammetry, potentiostatic current transients, rotating ring-disk electrode (rrde), and in situ scanning tunnelling microscopy (STM). It has been established that during the long-time polarization of the platinum electrode, at potentials close to the copper equilibrium potential, the concentration of Cu+ ions in the vicinity of the electrode increases and a Cu microdeposit if formed. The dissolution of the microdeposit occurs very slowly and takes several minutes of potential cycling in the range of 0.27-1.25 V. While the microdeposit is present on the platinum, the electrode surface is more active with respect to upd and bulk copper deposition. The combination of electrochemical and in situ STM results indicates that formation of surface alloy occurs during electrodeposition of copper on polycrystalline platinum.",
author = "Danilov, {A. I.} and Andersen, {J. E.T.} and Molodkina, {E. B.} and Polukarov, {Yu M.} and P. M{\o}ller and J. Ulstrup",
year = "1997",
month = "12",
day = "15",
doi = "10.1016/S0013-4686(97)00203-X",
language = "English",
volume = "43",
pages = "733--741",
journal = "Electrochimica Acta",
issn = "0013-4686",
publisher = "Elsevier Limited",
number = "7",

}

The influence of intermediate particles on the nucleation of copper on polycrystalline platinum. / Danilov, A. I.; Andersen, J. E.T.; Molodkina, E. B.; Polukarov, Yu M.; Møller, P.; Ulstrup, J.

In: Electrochimica Acta, Vol. 43, No. 7, 15.12.1997, p. 733-741.

Research output: Contribution to journalArticle

TY - JOUR

T1 - The influence of intermediate particles on the nucleation of copper on polycrystalline platinum

AU - Danilov, A. I.

AU - Andersen, J. E.T.

AU - Molodkina, E. B.

AU - Polukarov, Yu M.

AU - Møller, P.

AU - Ulstrup, J.

PY - 1997/12/15

Y1 - 1997/12/15

N2 - The influences of the Cu adatoms and Cu+ ions on the initial stages of copper electrodeposition on polycrystalline Pt in acidified copper sulphate solution have been studied by cyclic voltammetry, potentiostatic current transients, rotating ring-disk electrode (rrde), and in situ scanning tunnelling microscopy (STM). It has been established that during the long-time polarization of the platinum electrode, at potentials close to the copper equilibrium potential, the concentration of Cu+ ions in the vicinity of the electrode increases and a Cu microdeposit if formed. The dissolution of the microdeposit occurs very slowly and takes several minutes of potential cycling in the range of 0.27-1.25 V. While the microdeposit is present on the platinum, the electrode surface is more active with respect to upd and bulk copper deposition. The combination of electrochemical and in situ STM results indicates that formation of surface alloy occurs during electrodeposition of copper on polycrystalline platinum.

AB - The influences of the Cu adatoms and Cu+ ions on the initial stages of copper electrodeposition on polycrystalline Pt in acidified copper sulphate solution have been studied by cyclic voltammetry, potentiostatic current transients, rotating ring-disk electrode (rrde), and in situ scanning tunnelling microscopy (STM). It has been established that during the long-time polarization of the platinum electrode, at potentials close to the copper equilibrium potential, the concentration of Cu+ ions in the vicinity of the electrode increases and a Cu microdeposit if formed. The dissolution of the microdeposit occurs very slowly and takes several minutes of potential cycling in the range of 0.27-1.25 V. While the microdeposit is present on the platinum, the electrode surface is more active with respect to upd and bulk copper deposition. The combination of electrochemical and in situ STM results indicates that formation of surface alloy occurs during electrodeposition of copper on polycrystalline platinum.

UR - http://www.scopus.com/inward/record.url?scp=0032321184&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0032321184&partnerID=8YFLogxK

U2 - 10.1016/S0013-4686(97)00203-X

DO - 10.1016/S0013-4686(97)00203-X

M3 - Article

VL - 43

SP - 733

EP - 741

JO - Electrochimica Acta

JF - Electrochimica Acta

SN - 0013-4686

IS - 7

ER -