Pulse plating on gold surfaces studied by in situ scanning tunnelling microscopy

Jens E T Andersen, G. Bech-Nielsen, Per Møller

Research output: Contribution to journalArticle

10 Citations (Scopus)

Abstract

Deposition of bulk copper on thin film gold surfaces is carried out by computer-aided pulse plating. It is demonstrated that the morphology of the copper deposit can be studied by in situ scanning tunnelling microscopy both in potentiostatic experiments and in galvanostatic experiments. Optimized procedures for obtaining smooth deposits by pulse plating are explained in terms of a levelling effect. Possible non-faradaic processes observed in measurements with high frequency pulse plating are discussed.

Original languageEnglish
Pages (from-to)151-159
Number of pages9
JournalSurface and Coatings Technology
Volume67
Issue number3
DOIs
Publication statusPublished - Jan 1 1994

Fingerprint

Scanning tunneling microscopy
plating
Plating
Gold
scanning tunneling microscopy
gold
pulses
deposits
Copper deposits
copper
leveling
Copper
Deposits
Experiments
Thin films
thin films

All Science Journal Classification (ASJC) codes

  • Surfaces, Coatings and Films
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Engineering(all)

Cite this

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Pulse plating on gold surfaces studied by in situ scanning tunnelling microscopy. / Andersen, Jens E T; Bech-Nielsen, G.; Møller, Per.

In: Surface and Coatings Technology, Vol. 67, No. 3, 01.01.1994, p. 151-159.

Research output: Contribution to journalArticle

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