TY - GEN
T1 - Exploring the effect of rf power in sputtering of aluminum thin films-a microstructure analysis
AU - Mwema, F. M.
AU - Akinlabi, E. T.
AU - Oladijo, O. P.
PY - 2019
Y1 - 2019
N2 - In this article, a detailed image analysis on the field emission scanning electron microscopy of aluminum thin films sputtered on stainless steel substrates was presented. The effect of RF power on the structural and topography characteristics of the films was described. The physical observations of the surface micrographs, quantitative particle size and distribution, fractal dimensions, average surface roughness and widths of the multifractal spectra of all the films were related to the change in RF power. There existed a correlation between increasing RF power and fractal dimension and multifractal spectrum whereas there was no relationship established between power and height roughness of the films. Fractal and multifractal approaches appeared to provide better description of the effect of RF power on the sputtered Al thin films.
AB - In this article, a detailed image analysis on the field emission scanning electron microscopy of aluminum thin films sputtered on stainless steel substrates was presented. The effect of RF power on the structural and topography characteristics of the films was described. The physical observations of the surface micrographs, quantitative particle size and distribution, fractal dimensions, average surface roughness and widths of the multifractal spectra of all the films were related to the change in RF power. There existed a correlation between increasing RF power and fractal dimension and multifractal spectrum whereas there was no relationship established between power and height roughness of the films. Fractal and multifractal approaches appeared to provide better description of the effect of RF power on the sputtered Al thin films.
UR - http://www.scopus.com/inward/record.url?scp=85079278691&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85079278691&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:85079278691
SN - 9781532359507
T3 - Proceedings of the International Conference on Industrial Engineering and Operations Management
SP - 745
EP - 750
BT - 4th North American IEOM Conference. IEOM 2019
PB - IEOM Society
T2 - 4th North American IEOM Conference. IEOM 2019
Y2 - 23 October 2019 through 25 October 2019
ER -