Early IMK/IAA MIPAS/ENVISAT results

G. P. Stiller, T. V. Clarmann, T. Chidiezie Chineke, H. Fischer, B. Funke, S. Gil-López, N. Glatthor, U. Grabowski, M. Höpfner, S. Kellmann, M. Kiefer, A. Linden, M. López-Puertas, G. Mengistu Tsidu, M. Milz, T. Steck

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

On March 1, 2002 the space-borne limb viewing mid-infrared high-resolution Michelson Interferometer for Passive Atmospheric Sounding (MIPAS) has been brought on board the ENVISAT satellite into a polar sun-synchroneous orbit. Although the level-1 testing and validation phase has not been finished, ESA has made available datasets of 4 early orbits to several groups involved in MIPAS calibration/validation; the groups have been given the opportunity for functionality tests of their analysis codes. We here present some example results of the IMK/IAA MIPAS level-2 processor the concept of which is presented in a companion paper. Temperatures retrieved along the orbits are compared to ECMWF data. Processing parameters as chosen in pre-launch studies, such as cloud identification thresholds, microwindow selection, or instrument characteristics, are discussed. Preliminary retrievals for various atmospheric conditions are shown.

Original languageEnglish
Pages (from-to)184-193
Number of pages10
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume4882
DOIs
Publication statusPublished - 2002

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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  • Cite this

    Stiller, G. P., Clarmann, T. V., Chidiezie Chineke, T., Fischer, H., Funke, B., Gil-López, S., Glatthor, N., Grabowski, U., Höpfner, M., Kellmann, S., Kiefer, M., Linden, A., López-Puertas, M., Tsidu, G. M., Milz, M., & Steck, T. (2002). Early IMK/IAA MIPAS/ENVISAT results. Proceedings of SPIE - The International Society for Optical Engineering, 4882, 184-193. https://doi.org/10.1117/12.465164