Dissolution of base metals from wpcbs using Na2S2O8 solution

Szabolcs Fogarasi; Florica Imre-Lucaci; Petru Ilea; Paul Șerban Agachi; Árpád Imre-Lucaci

Dissolution of base metals from wpcbs using Na₂S₂O₈ solution

Szabolcs Fogarasi, Florica Imre-Lucaci, Petru Ilea, Paul Șerban Agachi, Árpád Imre-Lucaci

Chemical, Materials & Metallurgical Engineering

Research output: Contribution to journal › Article › peer-review

Abstract

The present work aimed to evaluate the performances of Cu, Zn and Ni dissolution from Waste printed circuit boards (WPCBs) obtained from mobile phones (MP) using different solid:liquid ratios (SLR) and oxidant concentration (C_ox). It was found that the increase of C_ox at constant SLR increases more the performances of Zn and Ni dissolution than it does for Cu. In contrast, the increase of SLR from 1:5 to 1:15 at constant C_ox diminished the dissolution efficiency of Ni by 79 %, of Zn with 55 % and in the case Cu by 22 %. The experimental results revealed that the most favorable conditions for the dissolution of Zn, Ni and Cu are provided at the SLR of 1:5 and 0.42 M Na₂S₂O₈.

Original language	English
Pages (from-to)	205-214
Number of pages	10
Journal	Studia Universitatis Babes-Bolyai Chemia
Volume	60
Issue number	3
Publication status	Published - Jan 1 2015

All Science Journal Classification (ASJC) codes

Chemistry(all)

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title = "Dissolution of base metals from wpcbs using Na2S2O8 solution",

abstract = "The present work aimed to evaluate the performances of Cu, Zn and Ni dissolution from Waste printed circuit boards (WPCBs) obtained from mobile phones (MP) using different solid:liquid ratios (SLR) and oxidant concentration (Cox). It was found that the increase of Cox at constant SLR increases more the performances of Zn and Ni dissolution than it does for Cu. In contrast, the increase of SLR from 1:5 to 1:15 at constant Cox diminished the dissolution efficiency of Ni by 79 %, of Zn with 55 % and in the case Cu by 22 %. The experimental results revealed that the most favorable conditions for the dissolution of Zn, Ni and Cu are provided at the SLR of 1:5 and 0.42 M Na2S2O8.",

author = "Szabolcs Fogarasi and Florica Imre-Lucaci and Petru Ilea and Agachi, {Paul Șerban} and {\'A}rp{\'a}d Imre-Lucaci",

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pages = "205--214",

journal = "Studia Universitatis Babes-Bolyai Chemia",

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TY - JOUR

T1 - Dissolution of base metals from wpcbs using Na2S2O8 solution

AU - Fogarasi, Szabolcs

AU - Imre-Lucaci, Florica

AU - Ilea, Petru

AU - Agachi, Paul Șerban

AU - Imre-Lucaci, Árpád

PY - 2015/1/1

Y1 - 2015/1/1

N2 - The present work aimed to evaluate the performances of Cu, Zn and Ni dissolution from Waste printed circuit boards (WPCBs) obtained from mobile phones (MP) using different solid:liquid ratios (SLR) and oxidant concentration (Cox). It was found that the increase of Cox at constant SLR increases more the performances of Zn and Ni dissolution than it does for Cu. In contrast, the increase of SLR from 1:5 to 1:15 at constant Cox diminished the dissolution efficiency of Ni by 79 %, of Zn with 55 % and in the case Cu by 22 %. The experimental results revealed that the most favorable conditions for the dissolution of Zn, Ni and Cu are provided at the SLR of 1:5 and 0.42 M Na2S2O8.

AB - The present work aimed to evaluate the performances of Cu, Zn and Ni dissolution from Waste printed circuit boards (WPCBs) obtained from mobile phones (MP) using different solid:liquid ratios (SLR) and oxidant concentration (Cox). It was found that the increase of Cox at constant SLR increases more the performances of Zn and Ni dissolution than it does for Cu. In contrast, the increase of SLR from 1:5 to 1:15 at constant Cox diminished the dissolution efficiency of Ni by 79 %, of Zn with 55 % and in the case Cu by 22 %. The experimental results revealed that the most favorable conditions for the dissolution of Zn, Ni and Cu are provided at the SLR of 1:5 and 0.42 M Na2S2O8.

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