Abstract
The present work aimed to evaluate the performances of Cu, Zn and Ni dissolution from Waste printed circuit boards (WPCBs) obtained from mobile phones (MP) using different solid:liquid ratios (SLR) and oxidant concentration (Cox). It was found that the increase of Cox at constant SLR increases more the performances of Zn and Ni dissolution than it does for Cu. In contrast, the increase of SLR from 1:5 to 1:15 at constant Cox diminished the dissolution efficiency of Ni by 79 %, of Zn with 55 % and in the case Cu by 22 %. The experimental results revealed that the most favorable conditions for the dissolution of Zn, Ni and Cu are provided at the SLR of 1:5 and 0.42 M Na2S2O8.
| Original language | English |
|---|---|
| Pages (from-to) | 205-214 |
| Number of pages | 10 |
| Journal | Studia Universitatis Babes-Bolyai Chemia |
| Volume | 60 |
| Issue number | 3 |
| Publication status | Published - Jan 1 2015 |
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All Science Journal Classification (ASJC) codes
- Chemistry(all)
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Dissolution of base metals from wpcbs using Na2S2O8 solution. / Fogarasi, Szabolcs; Imre-Lucaci, Florica; Ilea, Petru; Agachi, Paul Șerban; Imre-Lucaci, Árpád.
In: Studia Universitatis Babes-Bolyai Chemia, Vol. 60, No. 3, 01.01.2015, p. 205-214.Research output: Contribution to journal › Article
TY - JOUR
T1 - Dissolution of base metals from wpcbs using Na2S2O8 solution
AU - Fogarasi, Szabolcs
AU - Imre-Lucaci, Florica
AU - Ilea, Petru
AU - Agachi, Paul Șerban
AU - Imre-Lucaci, Árpád
PY - 2015/1/1
Y1 - 2015/1/1
N2 - The present work aimed to evaluate the performances of Cu, Zn and Ni dissolution from Waste printed circuit boards (WPCBs) obtained from mobile phones (MP) using different solid:liquid ratios (SLR) and oxidant concentration (Cox). It was found that the increase of Cox at constant SLR increases more the performances of Zn and Ni dissolution than it does for Cu. In contrast, the increase of SLR from 1:5 to 1:15 at constant Cox diminished the dissolution efficiency of Ni by 79 %, of Zn with 55 % and in the case Cu by 22 %. The experimental results revealed that the most favorable conditions for the dissolution of Zn, Ni and Cu are provided at the SLR of 1:5 and 0.42 M Na2S2O8.
AB - The present work aimed to evaluate the performances of Cu, Zn and Ni dissolution from Waste printed circuit boards (WPCBs) obtained from mobile phones (MP) using different solid:liquid ratios (SLR) and oxidant concentration (Cox). It was found that the increase of Cox at constant SLR increases more the performances of Zn and Ni dissolution than it does for Cu. In contrast, the increase of SLR from 1:5 to 1:15 at constant Cox diminished the dissolution efficiency of Ni by 79 %, of Zn with 55 % and in the case Cu by 22 %. The experimental results revealed that the most favorable conditions for the dissolution of Zn, Ni and Cu are provided at the SLR of 1:5 and 0.42 M Na2S2O8.
UR - http://www.scopus.com/inward/record.url?scp=84939431499&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84939431499&partnerID=8YFLogxK
M3 - Article
VL - 60
SP - 205
EP - 214
JO - Studia Universitatis Babes-Bolyai Chemia
JF - Studia Universitatis Babes-Bolyai Chemia
SN - 1224-7154
IS - 3
ER -